High-Speed Board-To-Board Connectors
Mezzanine systems featuring grounded connectors, high-density arrays, backplane interconnects, and ruggedized systems optimized for signal integrity, delivering high-speed performance of up to 56 Gbps NRZ or 112 Gbps PAM4.
High-Density Array Series Connectors
Product Images |
Product Name |
Product Pitch |
Number of Pins(Including planned) |
PCB Mounting |
Rated Voltage |
Mated Height |
Rated Current |
Transmission Speed |
|---|---|---|---|---|---|---|---|---|
|
0.635 mm (Signal) / 6.00 mm (Power) |
64 Cores, 248 Cores |
Vertical to Vertical |
200VAC |
5mm,10mm,16mm |
Power: 15.0 A / Signal: 1.54 A |
32Gbps NRZ/64Gbps PAM4 |
Product Images |
Product Name |
Product Pitch |
Core number Pin Deployment (including plans) |
PCB Substrate Interconnection Status |
Rated Voltage |
Fitting Height |
Rated Current |
Transmission Speed |
|---|---|---|---|---|---|---|---|---|
|
0.635mm |
40~400 Cores |
Vertical Fit– Vertical Fit |
150 VAC |
5mm,10mm |
1.2 A (4 pins powered) |
56Gbps NRZ/112Gbps PAM4 |
Product Images |
Product Name |
Product Pitch |
Core number Pin Deployment (including plans) |
PCB Substrate Interconnection status |
Rated Voltage |
Fitting Height |
Rated Current |
Transmission Speed |
|---|---|---|---|---|---|---|---|---|
|
0.8mm |
8 Pairs,12 Pairs, 16 Pairs, 24 Pairs, 32 Pairs |
Vertical Fit– Vertical Fit |
200VAC |
7mm,9mm,10mm,12mm |
2.1A per pin (signal) 9.6A per pin (ground) |
56Gbps NRZ/112Gbps PAM4 |
Product Images |
Product Name |
Product Pitch |
Core number Pin Deployment (including plans) |
PCB Substrate Interconnection status |
Rated Voltage |
Combined height |
Rated current |
Transmission Speed |
|---|---|---|---|---|---|---|---|---|
|
0.635mm |
40~400 Cores |
Vertical Fit– Vertical Fit |
155 VAC |
5mm、7mm、10mm、12mm |
1.34 A per pin (4 pins powered） |
Supports 64Gbps PAM4 (32Gbps NRZ) |