High-Density Array Series Connectors
AD Series High-density Array Connectors
Product Purpose:
◆5G/LTE 无线
◆远程 PHY、MSO
◆相控/数字阵列雷达
◆测试与测量仪器
◆低地球轨道/中地球轨道卫星
◆射频系统芯片
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Product Specifications
| Connector Shape | Plug/Socket | Baseboard Installation Method | BGA |
| Installation Form | Vertical Fit-vertical fit | Contact Direction | Bottom Contact |
| Inter-part Spacing | 0.635mm | Substrate Mounting Spacing | 0.635mm |
| Number of Cores | 40~400 Cores | Terminal Electroplating | Gold |
| Coating Thickness |
10~30μm |
Electrical Transmission Specifications | |
| Transmission Speed (Reference Value) | Supports 32 Gbps NRZ/64 Gbps PAM4 | Body Length (Spacing Direction) |
|
| Body Width (Vertical Direction) | 5mm | Combination Height | 5mm、7mm、10mm、12mm |
|
Rated Voltage（AC） |
150V | Rated Voltage（DC） |
|
| Rated Current |
1.34 A per pin (4 pins powered） |
Withstand Voltage Value |
|
| Impedance Matching |
|
Contact Resistance |
|
| Operating Temperature Range（Max） | 125 ℃ | Operating Temperature Range（Min） | -55 ℃ |
| Terminal Arrangement | Dual Row | RoHS2 | Yes |
| Product Floating Design | NO | Dual Contact Points | No |
| Product Positioning Pillar | Yes | Number of Plugs and Unplugs | 500 |
| The Product Uses a Suction Cup Cap | NO | The Product Uses Fire-Retardant Adhesive Paper for Adhesion | Yes |
| Locking Method | Auto I-Lock | Card Anti-dislodgement Function | Yes |
| Packaging Form | Emboss | Number of Packages | 2000 PCS |
■ ARS：Female；
■ ARP：Male
■ 015: 1.5mm;
■ 035: 3.5mm；
■ 065: 6.5mm；
■ 085: 08.5mm
■ L：10µ gold in contact area & matte tin at terminal tail;
■ S：30µ gold in the contact area & matte tin at the tail;
■ H：30µ gold in the contact area, solder tail with tin/copper.
4 ROW
2 ROW
■ 0: No solder balls
■ 1: 63.0% Tin & 37.0% Lead
■ 2: 96.5% Tin, 3.0% Silver, and 0.5% Copper
■ A：No locating pin
■ B：Positioning pin
■ TR: Roll packaging
■ FR: Full roll quantity with roll packaging
Product Order Coding Rules：XXX-XXS-XXX-X-X-X-X-XX
Product Series
Product Chip Count
Product Height
Terminal Plating Specifications
Terminal Row Number
Solder Ball Composition Specifications
Are there positioning posts
Packaging Specifications
10, 20, 30, 40, 50, 60,70, 80, 90, 100 (PER ROW)
Product Image |
Order Number |
Production Status |
Data Download |
Core Spacing [mm] |
Connection Method |
Fitting Height |
Width [mm] |
Number Of Cores |
Welding Fixing Plate |
Operating Temperature Range |
High-Speed Transmission |
Product Shape |
Product Series |
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Product Features
|
◆Extremely high density, with up to 240 I/Os; up to 400 I/Os are under development. ◆Slim design with a stacking height of 5~17mm ◆5mm thin width ◆4-row design; 10-100 needle positions per row ◆Rate terminal system for optimized signal integrity performance ◆The open terminal design allows for flexible grounding and wiring. ◆Supports 64Gbps PAM4 (32Gbps NRZ) applications ◆PCIe® Gen 6 compatible ◆Tin ball technology is easy to process and automatically align. ◆Stacking height of 7~16 mm, right angles and cables are under development. |
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Plating Specifications
Encoding
Terminal contact area
Terminal tail area
RoHS Directive
01+
Au 10µ，Au 30µ，
Si 30µ; SI-Cu 30µ
Corresponding