Precision Plating Finishing

To lead the "ROSH" green and environmentally friendly electroplating technology industry, we have been dedicated to researching and designing devices that explore the mysteries of electrolytic chemistry and the high-speed motion of precision machinery. Every day, we strive to achieve zero waste, zero wastewater discharge, zero air pollution, and maximize production efficiency. Our goal is to develop devices that are not limited by concepts and are less prone to malfunctions, utilizing the most advanced technologies. Simultaneously, by installing image processing cameras within the equipment, we can quickly detect discoloration and foreign objects, and manage and output NG (no good) history records. Our specialized image processing guide rollers are designed to suppress workpiece vibration and resonance, thereby achieving stable image processing inspection and ensuring consistent product quality.


Precision local gold plating technology

To address the challenge of localized gold plating in minute areas of B2B connectors (minimum height of the Ni stopband = 0.1mm), our company has successfully developed an ultra-precision electroplating fixture. High-speed electroplating is made possible by improving electroplating efficiency through high-speed liquid spraying (patent pending).

Tin whisker suppression technology

Sn plating is used in various connectors and module busbars. However, after plating, needle-like crystals called whiskers may grow, causing problems such as short circuits or damage to electronic circuits.


An alloy layer forms through interdiffusion between the Cu base and Sn. The primary diffusion alloy layer formed at room temperature is "Cu6Sn5," with a volume larger than Cu but smaller than Sn. The compressive stress generated by this volume change (expansion) becomes the driving force for whisker growth. Furthermore, stress applied directly from the outside will result in a shorter growth cycle.
Tin Whisker Measures:
Apply nickel plating to the substrate as an anti-diffusion layer.
Reflow soldering after tin plating.
Annealing after tin plating.
Tin plating.
We will take various measures to address these issues depending on the application and cost. In every case, there have been over 10 years without whisker formation, and long-term quality stability has been achieved.

Electroplating related technical analysis and measurement equipment