2024
Teramount employs an innovative detachable fiber-to-chip connector that supports an industry-first mix of over 32 SM/PM fibers with a 127µm pitch. This fiber count and density deliver unmatched bandwidth density for co-packaged optics (CPO).
NewPhotonics NPG102 PIC TOC for DSP-based Modules
The future of 1.6Tbps photonic integration is here! We are making headlines once again with our monolithic integrated laser within an advanced on-chip transmitter solution.
Coupled light to PICs (photonic integrated circuits) remains one of the most critical challenges in silicon photonics design. At DustPhotonics, we have designed an innovative solution to this problem, which we call Low-Loss Laser Coupling (L3C). This is a patented technology that enables higher performance and scalability.
Driven by artificial intelligence clusters and cloud data centers, there is a growing need for faster and more efficient data transfer. The racks of compute engines (GPUs, CPUs, and storage) and supporting network infrastructure required for these applications consume significant amounts of grid power. In a power-constrained AI cluster or data center, every watt used by the network is a watt that cannot be allocated to computers.