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High-Density Array Series Connectors

NVR Series High-density Array Connectors

Artificial intelligence and machine learning (AI/ML) applications are driving the development of new system architectures that require higher speed, frequency bandwidth, frequency and density, as well as scalability and configurability.To address these challenges, Kyomori-Ka offers a range of connector and cable options ideal for supporting next-generation AI/ML applications such as vision system accelerators and array servers; systems and computers on modules; computing platform chipsets; and ultra-low latency products.For designers, Kyomori-Ka provides system-wide optimization support, characterization and development boards, and online design and development tools, leveraging industry-leading expertise in signal integrity design.

The NVR series connectors combine extremely high density with 112 Gbps PAM4 performance per channel, saving 40% more space than traditional arrays.The innovative design of the NVR series connectors combines extremely high density and performance, which is crucial for reducing system size and increasing speed. A fully shielded differential pair design and two reliable contacts enable an industry-leading aggregated data rate of 4.0Tbps. The NVR series connectors are designed not only to operate at 112Gbps PAM4 performance but also to provide a path to 224Gbps. This is possible due to its unique BGA connector architecture, double-point snap-fit contacts on each contact pair, a dedicated differential pair design, and shielding and grounding around each differential pair, enabling 224Gbps performance.

Product Purpose:

◆5G/LTE Wireless	◆Remote PHY、MSO	◆Phased/Digital Array Radar	◆Test and Measuring Instruments	◆Low Earth Orbit/Medium Earth Orbit Satellites	◆Radio Frequency System Chip

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Product Catalog Product Drawing 3D(igs/stp) Product Specifications Test Report(TR) Product Packaging Specifications RoHS Report

Product Specifications

Connector Shape	Plug/Socket	Baseboard Installation Method	BGA
Installation form	Vertical Fit-vertical fit	Contact Direction	Bottom Contact
Spacing Between Fitting Parts	0.8mm	Baseboard Mounting Spacing	0.8mm
Number of Cores	8 Pairs,12 Pairs, 16 Pairs, 24 Pairs, 32 Pairs	Terminal Electroplating	Gold
Coating Thickness	10~30μm	Electrical Transmission Specifications
Transmission Speed (Reference Value)	Supports 56Gbps NRZ/112Gbps PAM4	Body Length （Split Direction）
Body Width (Vertical Direction)		Combination Height	7mm,9mm,10mm,12mm
Rated Voltage（AC）	200V	Rated Voltage（DC）
Rated Current	2.1 A（Signal）per needle 9.6 A（Grounded）per pin	Withstand Voltage Value
Impedance Matching		Contact Resistance
Operating Temperature Range（Max）	125 ℃	Operating Temperature Range（Min）	-55 ℃
Terminal Arrangement	Dual Row	RoHS2	Yes
Product Floating Design	NO	Dual Contact Points	No
Product Positioning Pillar	Yes	Number of Plugs and Unplugs	500
The Product Uses a Suction Cup Cap	NO	The Product Uses Fire-Retardant Adhesive Paper for Adhesion	Yes
Locking Method	Auto I-Lock	Card Anti-dislodgement Function	Yes
Packaging Form	Emboss	Number of Packages	2000 PCS

Product Order Coding Rules：XXX-XXS-XXX-X-X-X-X-XX

Product Series

Product Core Number

Terminal Row Number

Terminal Plating Specifications

Number of Terminal Groups

Composition and Type of Welding Ball Material

Are There Positioning Posts

Packaging Specifications

■ NVRS：Female；

■ NVRP：Male

DP=4 pairs per wafer

■ 02: 2 ROW

■ 03: 3 ROW

■ 04: 4 ROW

■05: 5 ROW

■06: 6 ROW

■ S：30µ gold in the contact area & matte tin at the tail

4 ROW

3 ROW

2 ROW

■ 0: No solder balls

■ 1: 63.0% Tin & 37.0% Lead

■ 2: 96.5% Tin, 3.0% Silver, and 0.5% Copper

■ A：No locating pin

■ B：Positioning pin

■ TR: Roll packaging

■ FR: Full roll quantity with roll packaging

Product Image	Order Number	Production Status	Data Download	Core Spacing [mm]	Connection Method	Fitting Height	Width [mm]	Number Of Cores	Welding Fixing Plate	Operating Temperature Range	High-Speed Transmission	Product Shape	Product Series

Product Features


■112 Gbps PAM4 per channel ■4.0 Tbps total data rate - 9 IEEE 400G channels ■PCIe® 6.0 compatible ■The innovative integrated shielded differential pair design achieves:： Extremely low crosstalk (down to 40 GHz) Strict impedance control Minimum variance of data rate as stack height increases ■112 difference pairs per square inch ■40%Compared to traditional arrays with the same data throughput, the space used is reduced by 40%. ■It is mounted on the board using ball grid array (BGA) packaging technology to achieve higher density and optimize the routing area.

■Two terminals are always available, ensuring a more reliable connection. ■Pile-free connection ■The signal lost at the first connector will be captured at the second connector. ■Achieved 112 Gbps PAM4 rating ■The 92Ω solution addresses the problems encountered in applications with 85Ω and 100Ω impedances.